Thermal silica gel how to use thermal silica gel how to choose

The thermal silica is mainly used in the heat-dissipating and heat-dissipating functions of heat-generating components. The properties of ordinary heat-conductive silicas depend on the aluminum hydroxide components incorporated into the heat-conducting silica gel. Of course, a special thermal grease will incorporate an appropriate amount of noble metal oxides. Then, the next small series for everyone to introduce how to use thermal silica and how to choose the thermal silica.

How to use thermal silica gel

1. First, clean the CPU core and the heatsink surface with a high-purity solvent such as high-purity isoamyl alcohol or acetone and a lint-free cloth (such as a cloth for cleaning the lens) (a fingerprint may be as thick as 0.005 inches). (This step can be omitted when the surface is oil-free, as long as the surface is clean and oil-free.)

2. Determine the area of the heat sink that is in contact with the CPU and squeeze enough thermal grease in the center of the area.

3. Use a clean tool such as a razor blade, a credit card edge, or a clean knife to pick up a bit of thermal grease transferred to the CPU core (such as the lower left corner or the like). Note that only a small piece is enough, almost half a grain of rice.

4. Put your fingers in a plastic bag, and then use your fingers to rub the thermal grease on the bottom of the heat sink until the thermal grease uniformly covers the entire area in contact with the CPU. Clockwise and counterclockwise movements can be used to ensure that the thermal grease fills the gap at the bottom of the heatsink and uneven areas. Note: Do not apply directly with your finger!

5. Use a lint-free cloth to wipe away the thermal grease from the bottom of the heat sink. At this time, you can see that the heat-sink applied at the bottom of the heat sink is not the same as the color of other areas, indicating that the thermal grease has filled the gap of the base evenly.

6. Using a razor blade or other clean tool, start from the corner of the CPU core and spread the thermal grease evenly over the entire core. The flatter the surface to be contacted is, the thinner the thermal grease is. For an ordinary radiator bottom surface, the thickness of the thermal grease is about the thickness of a piece of plain paper (0.003-0.005 inch). If the bottom surface of the heat sink is bright and smooth, the thermal grease can be thinned to a translucent shape.

7. Make sure that there is no foreign matter on the surface of the radiator base and CPU core. Put the heat sink on the CPU. At this time, light pressure can only be applied, and the radiator cannot be turned or translated. Doing so may cause uneven thermal grease thickness between the heat sink and the CPU.

8, buckle buckle, complete.

How to choose thermal silicone

1, product structure design choice

In the early stage of the structural design of electronic products, the thermal conductive silicone film should be considered into the design problem. Under different requirements and using environments, the heat dissipation scheme is different, and the optimal heat dissipation scheme should be selected in combination with the actual situation to design a reasonable heat dissipation structure. , Maximize the effect of thermally conductive silicone sheet.

2, the thermal conductivity of silica film selection

Thermal conductivity selection, one to see the effect you expect to achieve, the other depends on the size of the heat source, and the heat that the heat sink or heat sink design can dissipate. According to these requirements, the thermal conductivity of the thermal silica sheet is selected. The cost of low thermal conductivity is relatively low, the thermal conductivity is high and the cost is high.

3, the choice of thermal silica film thickness

This thickness should take into account the heat dissipation scheme used by the electronic product itself. If the heat dissipation structure is selected for heat dissipation, it is necessary to consider the morphological structure of the heat dissipation structure at the contact surface, and balance the design structure and the thickness of the thermal silica film. The thickness selection is also related to the hardness, density, compression ratio and other parameters of the product.

4, the choice of thermal silica film size

The best way to size the thermal silica film is to cover the heat source. Breakdown voltage, resistance, surface resistivity, etc. can satisfy the conditions.

Hot silicone application range

The thermal silica gel can be widely applied to the contact surfaces between the heating elements (power tubes, thyristors, electric heat stacks, etc.) and the heat dissipation facilities (heat sinks, heat sinks, housings, etc.) in various electronic products and electrical equipment. It functions as a heat transfer medium, moisture-proof, dust-proof, anti-corrosion, and shockproof. It is suitable for surface coating or overall encapsulation of various microwave devices such as microwave communication, microwave transmission equipment, microwave power supply, power supply, etc. This type of silicon material provides excellent heat conduction effect to the electronic components that generate heat. Such as: Transistors, CPU assembly, thermistors, temperature sensors, automotive electronics components, automotive refrigerators, power modules, printer heads, etc.

Editor's summary: How to use the thermal silica gel and how to choose the thermal silica gel introduced here, I hope to be helpful to everyone. If you want to know more related information, you can pay attention to this website information.

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